PCBA chip sampling is an important part of the development of electronic products,pcb making company and the tin is not full is a common problem in the sampling process. This problem has caused the majority of electronic product developers concern and distress.
In this paper, we will discuss why PCBA chip sampling will appear on the tin is not full of reasons,multilayer pcb and put forward to solve this problem of effective methods.
First of all, it may be related to the welding temperature is not appropriate. In the PCBA chip sampling process, the soldering temperature plays a vital role in the melting and flow of solder paste.PCB board china If the soldering temperature is not set properly, resulting in the soldering process, solder paste can not be fully melted and flow, so that the tin is not full of the situation. Therefore, the correct and reasonable setting of the soldering temperature is the first step to solve the problem of tin is not full.
Secondly, it may be related to the quality of the solder paste. Solder paste is an important material in the PCBA chip proofing process, its quality directly affects the welding quality. If the quality of the paste is not good or expired, the active agent component will gradually decompose and become ineffective, the fluidity of the paste will deteriorate, resulting in the tin is not full of problems. Therefore, in the PCBA chip sampling in the choice of quality and reliable solder paste suppliers, regularly check the shelf life of the solder paste and quality, is the key to solve the problem of tin is not full.
Third, it may be related to the surface treatment of the PCB board, PCB board surface treatment is to increase the adhesion between the PCB board and the welding material, to ensure the key link of welding quality. If the PCB board surface treatment is not appropriate or the treatment agent is not used correctly, it may lead to poor wettability of the PCB board surface, the solder paste can not adequately cover the soldering point, thus appearing on the tin is not full of the situation. Therefore, the correct selection and use of PCB board surface treatment agent to improve the wettability of the PCB board surface is an important measure to solve the problem of tin is not full.
Finally, it may be inaccurate with the placement of patch components. In the PCBA patch proofing process, the placement of patch components for welding quality has a critical impact. If the placement of the chip assembly is not accurately placed to the center of the pad, or placed with the placement of the mounter of the mouth of the material is not high alignment, will lead to the tin is not full of problems. Therefore, to ensure the accurate placement of SMD components, improve accuracy and stability, is an important means to solve the problem of tin not full.
In summary, the PCBA chip sampling process on the tin is not full of problems is the result of a combination of factors. Correctly set the soldering temperature, select a reliable quality of the solder paste supplier, the correct use of PCB surface treatment agent, to ensure the accurate placement of SMD components and other measures can effectively solve the problem of tin is not full, to improve the quality and efficiency of the PCBA SMD prototyping.
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